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晶圆加工胶带

晶圆加工胶带

晶圆加工胶带主要类型Main types:切割?胶带Cutting tape、研磨?胶带Abrasive tape。晶圆胶带可指定It can be specifified:厚度、硬度、颜?、粘度、耐热度、防静电、UV/Non UV、宽度、?宽。
产品详情

研磨用胶带

Backgrinding Tapes

在背面研磨过程中用于保护半导体晶圆的胶带。

Tapes for protection of semiconductor wafers during the back-grinding process.

用紫外线加热或剥离的方法卸除胶带。

UV, Heat & Peel Releasing Adhesive Tapes.

带球晶圆用胶带

Tape for Bumped Wafers

带球晶圆需要在背面研磨期间具有出色的球保护性能,球将成为应力集中的来源。胶带必须具有较厚的粘合剂兼容层,以容纳金球和焊料球的晶圆,以实现精确且无应力的减薄。

Bumped Wafers requires to have excellent bump protection performance during back grinding, the bumps will be the source of stress concentration。The tape needs to have a thicker layer of the adhesive-compliant to accommodate gold-bumped and solder-bumped wafers for accurate and stress-free thinning。

切割用胶带

Dicing Tapes

胶带是为在切割过程中固定半导体晶圆或封装而设计的。

Tapes are designed for holding semiconductor wafers or package during the dicing process.

磁带可用于以下过程

Tapes Available for Following Processes

激光切

Laser Dicing

锯切

Saw Dicing

等离子切割

Plasma Dicing

激光隐形切割

Stealth Laser Dicing

可扩展胶带,用于激光隐形切割

Expandable Tape for Stealth Dicing

激光隐形切割通过胶带

Backside Stealth Laser Dicing Through Tape

贴片胶带

Die-Attach Tapes

该胶带兼具了划片胶带和芯片附着膜的功能。与传统的切割胶带相比,它具备的芯片连接材料层,更有助于将芯片连接与切割工艺结合。

This tape has the functional combination of dicing tape and die-attach film. It has an additional layer of die-attach material compared to conventional dicing tape which helps combine the die-attach with the dicing process.


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