九州bet网址-bet九州平台入口

全国统一电话

0769-8275 0082

暂无记录
九州bet网址 经营品牌 经营品牌 半导体封装材料 经营品牌
半导体封装材料

半导体封装材料

东莞建盟化学有限企业代理经销日本信越,台湾环球,日本胜高半导体封装材料,提供产品种类用途,型号品牌.半导体封装材料用于LED,电气和电子部件封装等领域.

如果您需要帮助,不要犹豫,请告诉大家!大家的专家将会通过电话或电子邮件与你联系。电子邮件

产品详情

半导体用环氧树脂封装材料

Epoxy Resin Materials for Semiconductors Packaging

环氧基封装材料是用于各种电子零件的传递模塑系统的材料。 它是利用通过有机硅开发而培养的先进技术开发的。 它具有优异的低应力、低翘曲和高导热性。不仅用于一般的表面贴装器件,还用作大型汽车电源模块和各种传感器的高可靠性封装材料。

Epoxy-based encapsulation materials are materials for a transfer molding system for various electronic parts. It is developed with the advanced technology cultivated through the development of silicone. It has excellent low stress, low warpage, and high thermal conductivity.Used not for only a general surface mount device but also as highly reliable encapsulation materials for large automotive power modules and various sensors.

LED用硅胶封装材料

Silicone Encapsulation Material for LED

封装材料用硅树脂,白光LED、紫外光LED、蓝光LED等各种LED的密封材料。 有机硅树脂是具有三维支链结构的相对低分子量的聚合物。由于LED的高盲度,可以利用有机硅的长期耐久性、高温稳定性、高附着力、即使在高温下工作时的高折射率等特性,生产劣化较少的LED器件。 用于白光光源的涂层 LED 芯片,它可以与荧光粉混合或作为与荧光粉混合的薄膜。

Silicone resin for encapsulation materials, sealing material for various LEDs like white LED, ultraviolet LED, blue LED. Silicone resins are relatively low molecular weight polymers with a three-dimensional branched-chain structure。LED devices with less deterioration can be produced by utilizing the characteristics of silicone such as long-term durability, high-temperature stability, high adhesion, and high refractive index even at high temperature operating due to high blindness of LED. Coating LED chip used for a source of white light, it can be mixed with phosphor or as a film mixed with phosphor.

矽胶成型材料

Silicone Molding Material

有机硅模塑料可用于电气和电子部件封装的热固性传递模塑系统。 它含有以有机硅树脂为基础的各种填料和添加剂。它具有优良的耐热性、耐寒性和抗降解性。由于不会因温度和频率而改变特性,因此显示出稳定的电绝缘性能。

Silicone molding compound can be used in thermosetting transfer molding systems for electric and electronic parts encapsulation。It is contained various fillers and additives based on silicone resin。It has excellent heat resistance, cold resistance, and degradation resistant。It is shown stable electrical insulation performance because it is not changing properties by temperature and frequency.

液状环氧树脂封装材料

Liquid Epoxy Encapsulation Packaging Material

液态环氧封装材料是基于半导体器件开发的液态环氧材料的一种组分类型,特别适用于底部填充应用。 由液态环氧树脂封装成型的半导体器件具有优异的电气特性和防潮性。此外,通过使用特定的硅胶技术,它在减轻压力方面表现出出色的功能。

The liquid epoxy encapsulation material is one component type of liquid epoxy materials developed on basis of semiconductor devices for especially underfill application. Semiconductor devices molded by liquid epoxy encapsulation have excellent electrical characteristics and moisture resistance. In addition,it is shown outstanding function on stress reduction by using a specific technique of silicone.

功率模块灌封

Potting for Power Modules

大坝和盆栽

Dam & Potting

高导热底部填充胶 High thermal Conductive Underfill

毛细管底部填充 Capillary Underfill

板级底部填充 Board Level Underfill

半导体元器件涂层材料

Coating Materials for Semiconductor Components

有机硅涂层材料具有多种应用优势,例如高粘附性、改进的耐热性、改进的防潮性、降低应力。 在具有保护电气性能的半导体器件上表现出更好的性能起着重要作用。 有机硅的特性具有优异的耐光性,由于其热稳定性和对无机材料的高附着力,使其成为各种材料的涂层材料的理想选择。

Silicone coating materials have various application advantages such as high adhesiveness, improved heat resistance, improved moisture resistance, stress reduction. It plays a major role to show better performance on semiconductor devices with protecting electrical performance. Properties of silicone have excellent light resistance which makes it a good choice as a coating material for various materials due to thermal stability, high adhesion to inorganic material.

B-阶段胶化裸晶黏结材料

B-stage Epoxy Die Attach

B-阶段贴片材料有环氧树脂和硅胶两种。 环氧树脂基 B 阶材料是一种高纯度绝缘芯片粘接材料,专为模板或丝网印刷而开发。 在 B 阶段状态下表现出良好的释放稳定性、形状保持性、储存稳定性。 芯片键合后,可以通过高温加热重新熔化,并像热固化一样处理。 固化后显示出高低应力。

B-stage die-attach materials are of two types, epoxy and silicone type. Epoxy-based B-stage material is a high purity insulating die-attach material developed for stencil or screen printing. Showing good performance release stability, shape retention, storage stability at B-stage status. After chip bonding, it can be re-melted by heating at high temperature and treat like thermal curing. It shows high low stress after curing.


友情链接: 相变材料 硅烷偶联剂 无缝管 百度一下 奇裕硅橡胶 东莞SEO 化学试剂网 多肽合成服务 液体硅胶厂家 液压货梯 广州陶粒 东莞酒吧网 液氮生物容器 破碎机
下载资料

九州bet网址|bet九州平台入口

XML 地图 | Sitemap 地图